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Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products

Mehmet A Ilgin^*, Surendra M Gupta and Kenichi Nakashima

* Corresponding author: Mehmet A Ilgin mehmetali.ilgin@deu.edu.tr

Journal of Remanufacturing 2011, 1:7 doi:10.1186/2210-4690-1-7

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